I510M0L0-2L-DVK
image shown is a representation only
Description:
OHIO PCB DEV KIT
Supplier:
iVativ
Matchcode:
OHIO PCB DEV KIT
Rutronik No.:
RFMCU2318
Unit Pack:
1
MOQ:
3
package:
PCB
Packaging:
BOX
Datasheet
Add to Project
Samples
Download the free Library Loader to convert this file for your ECAD Tool
- Frequency min
- 2360 MHz
- Frequency max
- 2500 MHz
- Oper.temp.min.
- -40 °C
- Memory
- FLASH
- Memory size
- 192 kB
- MCU Architectur
- 32 bit
- Supply Volt.min
- -0,3 V
- RAM
- 24 kB
- GPIO
- 30 no.
- SPI
- YES
- USB
- YES
- I²C
- YES
- IEEE802.15.4
- YES
- IEEE802.15.1
- YES
- Wireless
- TRANSCEIVE
- Oper.temp.max
- 85 °C
- Supply volt.max
- 3.6 V
- Automotive
- NO
- Package
- PCB
- RoHS Status
- RoHS-conform
- Packaging
- BOX
- ECCN
- EAR99
- Customs Tariff No.
- 85437090990
- Country
- India
- Supplier Lead time
- 14 weeks
The OHIO Development Kit (DVK) is a platform that enables development of hostless Bluetooth Low Energy wireless connectivity. It provides multiple peripheral interfaces (SPI, UART, I2C) for easy integration with peripheral devices. The DVK includes Development tool chain, software development kit for Application development and example applications to test the following:
- Bluetooth Low Energy Wireless Functionality
- Concurrent mode
- Peripherals such as LEDs, Buttons, external memory, headers
- Module power consumption
- Wireless/Serial Firmware Upgrade
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