2EDL8034G4CXTMA1
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- Channels
- 2
- V(op,min)
- 8 V
- V(op,max)
- 17 V
- V(op,abs,max)
- 17 V
- I(lim,min)/Ch
- 4 A
- T(j,min)
- -40 °C
- T(j,max)
- 150 °C
- V(in,min)
- -0,3 V
- V(in,max)
- 20 V
- Automotive
- NO
- Package
- VDSON-10
- RoHS Status
- RoHS-conform
- Packaging
- REEL
- Supplier Part
- SP005612544
- ECCN
- EAR99
- Customs Tariff No.
- 85423990000
- Country
- Thailand
- Supplier Lead time
- 18 weeks
120 V boot 4 A high and low side junction isolated gate drivers
The 2EDL8034G4C is designed to drive both high-side and low-side MOSFETs in a half-bridge configuration. The floating high-side driver is capable of driving a high-side MOSFET operating up to 120 V bootstrap voltage and provides full 4 A current capability. The high-side bias voltage is generated using a bootstrap technique using an integrated bootstrap diode. The inputs of the driver are TTL logic compatible and can withstand input common mode swing from -10 V up to 20 V. Independent inputs allow controlling high- and low-side domains independently. Undervoltage lockout (UVLO) on both high- and low-side supplies forces the corresponding outputs low in case of insufficient supply.
The 2EDL8034G4C is available in SON-10 pins 4 mm x 4 mm package.
Summary of Features
- 3 A & 4 A source / 6 A sink output current capability
- 120 V absolute maximum boot voltage
- Integrated bootstrap diode
- -10 V to 20 V input pin capability for increased robustness
- -5 A output pin reverse current capability
- -12 V absolute maximum negative voltage on HS
- 8 V to 17 V supply voltage operating range
- UVLO for both high-side and low-side driver
- Fast propagation delay (< 35 ns)
- 2 ns typical delay matching
- Offered in SON-10 (4x4) package
- Specified from -40ºC to 125ºC operating junction temperature range
Benefits
- Best in class driving capability with 3 A & 4 A source / 6 A sink output current capability
- Helps in achieving better efficiency due to its strong source/ sink capability
- Strong 6 A pull down for avoiding induced turn on
- Tight propagation delay matching reduces dead time losses
- Offered in small 4 x 4 mm leadless package with industry standard pin-out
- Integrated bootstrap diode reduces BOM cost and increases power density
Potential Applications
- Telecom/Datacom half- and full-bridge power converters
- Current-fed push-pull converters
- Buck converters
- Two-switch forward converters
- Active clamp forward converters
- Class D amplifiers
- DC motor drives
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