FT7T68ES4APHBPI
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- Capacity
- 8TB
- Technologies
- TLC
- Interface
- PCIE4.0 X4
- Temp.min.
- 0°C
- Formfactor
- E1.S
- Height
- 9.5 mm
- Temp.max.
- 75°C
- RoHS Status
- RoHS-conform
- Packaging
- INDIVIDUAL
- Automotive
- NO
- ECCN
- EAR99
- Customs Tariff No.
- 85235110000
- Country
- Taiwan
- ABC-Code
- A
- Supplier Lead time
- 8 weeks
Key features:
- PCIe Gen4 x4 interface
- E1.S 9.5 mm symmetric enclosure
- Industrial temperature operable
- Thermal Management Solution
- MCU-based Power Loss Protection Design with Level 4 (data-in-flight) protection
- Hot-pluggable/Hot-swappable
Built with 176-layer NAND and boasting an impressive 5,000+ program/erase (P/E) cycle endurance, ATP's E1.S SSDs are designed for optimal performance leveraging cutting-edge PCIe® interface and NVMe protocol technologies.
Engineered for 1U Edge servers, ATP's E1.S SSDs are designed for vertical placement in small-footprint systems, allowing up to 6 to 12 drives in a 1U chassis. They support hot swapping/hot plugging for easy serviceability and replacement of drives while the system is on.
High cross-temperature reliability translates to low bit errors and better transmission accuracy for higher data integrity.
Housed in a 9.5 mm symmetric enclosure, ATP’s E1.S SSDs are a result of thermal management solutions.The enclosure features customized hardware and sustained performance firmware tuning, making it an ideal solution to meet the demanding requirements of hyperscale architecture.
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